Postdoctoral Research Fellow (Advanced Microelectronics Packaging) / Tutkijatohtori (Edistyneet Mik

Postdoctoral Research Fellow (Advanced Microelectronics Packaging) / Tutkijatohtori (Edistyneet Mikroelektroniikan Pakkausteknologiat)

Tampere University and Tampere University of Applied Sciences create a unique environment for multidisciplinary, inspirational and high-impact research and education. Our university community has its competitive edges in technology, health and society. www.tuni.fi/en

We are looking for Postdoctoral Research Fellows in the field of Advanced Microelectronics Packaging. The full-time position will be filled for a fixed-term period of 4 years and is connected to TAU's PROFI8 profiling actions and focuses on fundamental technology and methods development for next-generation semiconductor packaging and heterogeneous integration. The position is located in the in the Electrical Engineering Unit of the Faculty of Information Technology and Communication Sciences.

JOB DESCRIPTION

Research scope (fundamental methods development)

The postdoctoral research fellow will develop and validate low-TRL integration methods that enable electronics-photonics co-packaging and heterogeneous integration across 2D / 2.5D / 3D schemes, including both chip-to-wafer (C2W) and chip-to-chip (C2C) approaches.

Core technical directions

Heterogeneous integration of wide-bandgap (WBG) electronic components (e.g., GaN/SiC and related platforms) towards high-speed photonics and power electronics, including interface reliability, electrical/thermal interface quality, and thermal-management concepts enabled by thin devices and advanced substrates.

Heterogeneous integration of photonic components towards high-density integrated circuits and high-performance III-V functional blocks (e.g., lasers, photodiodes, and high-speed devices), with focus on precision alignment, interface quality, and scalable assembly concepts.

Method development in advanced integration approaches such as micro-transfer printing (µTP), layer transfer concepts, and advanced packaging/intercon