Senior Advanced Packaging & Reliability EngineerJoin Smart High Tech
Smart High Tech is a Swedish DeepTech company developing advanced graphene-enhanced Thermal Interface Materials (TIM) for next-generation AI, semiconductors, high-performance computing, data centres and advanced electronics.
As semiconductor performance and power density continue to increase, advanced packaging, thermal management and long-term reliability are becoming increasingly critical.
We are now strengthening our R&D team with a Senior Advanced Packaging & Reliability Engineer who wants to help solve these challenges and contribute to the next generation of semiconductor technology.
Your Mission
As Senior Advanced Packaging & Reliability Engineer, you will work at the intersection of advanced packaging, materials science, thermal management and reliability engineering.
You will help us understand how our materials and interfaces perform within advanced semiconductor packaging environments by combining simulation, experimental testing, reliability assessment and failure analysis.
You will work closely with our R&D, engineering and product development teams as well as international customers, research institutes and technology partners.
What You'll Be DoingAdvanced Packaging & Reliability
Evaluate materials and interfaces for advanced semiconductor packaging applications.
Work with technologies such as 2.5D/3D integration, heterogeneous integration, flip-chip and wafer-level packaging.
Develop and perform reliability assessments and testing.
Investigate thermal, mechanical and interfacial failure mechanisms.
Conduct failure analysis and root-cause investigations.
Modelling & Simulation
Perform thermo-mechanical modelling and finite element analysis.
Model stresses, deformation and failure mechanisms in packaging structures and interfaces.
Correlate simulation results with experimental data.
Use simulation and testing to support material and product optimisation.
R&D & Product D